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Semiconductor device
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#	Item
491	Embedding of Chips for System in Package realization – Technology and Applications Lars Boettcher 1, Dionysios Manessis 2, Andreas Ostmann 1 Stefan Karaszkiewicz 2 and Herbert Reichl 2 1 Fraunhofer Institute for Relia Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-05-06 04:02:53 Integrated circuits Semiconductor devices Electronics manufacturing Electrical engineering Semiconductor device fabrication Quad-flat no-leads package Printed circuit board Three-dimensional integrated circuit Flip chip Electronics Electromagnetism Electronic engineering
492	Cleanroom safety authorization checklist Before being authorized to use the clean room you must be able to check off all of the following points and make yourself familiar with the appendices and links mentioned (all doc Add to Reading List Source URL: wiki.nbi.ku.dk Language: English - Date: 2013-06-20 08:39:03 Filters Rooms NBI Nanowire Hydrofluoric acid Chemistry Semiconductor device fabrication Cleanroom
493	FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION IZM WAFER LEVEL MEMS PACKAGING 3D wafer level system integration is one sealed by bonding of a cap wafer onto Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2013-01-18 04:24:22 Technology Electronics manufacturing Chemical bonding Wafer bonding Microelectromechanical systems Deep reactive-ion etching Wafer Through-silicon via EV Group Semiconductor device fabrication Materials science Microtechnology
494	Good cleanroom practice and rules at NBI The safety of you and coworkers in the lab is of utmost importance. Although we encourage constructive feedback on safety procedures, and how to improve them, you must accept that Add to Reading List Source URL: wiki.nbi.ku.dk Language: English - Date: 2015-03-02 03:29:55 Health Risk Filters Rooms Semiconductor device fabrication Cleanroom Fume hood Occupational safety and health Material safety data sheet Safety Industrial hygiene Safety engineering
495	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M Fraunhofer IZM – ASSID All Silicon System Integration Dresden All Silicon System Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-05-05 17:47:15 Technology Three-dimensional integrated circuit Wafer Through-silicon via Fraunhofer Society Fraunhofer Group for Microelectronics Integrated circuit Flip chip Semiconductor device fabrication Electronics Microtechnology
496	Industrial Energy Efficiency Accelerator - Guide to the microelectronics sector The UK microelectronics sector uses more than 1,300 GWh of energy each year representing nearly 710,000 tonnes in carbon dioxide Add to Reading List Source URL: www.carbontrust.com Language: English - Date: 2012-10-18 07:40:42 Technology Cleanroom Environment Sustainability Climate change policy Applied Materials Semiconductor device fabrication Low-carbon economy Semiconductor fabrication plant
497	Morphology and elastic properties of swift heavy ion tracks in quartz B. Afraa, M. D. Rodrigueza, K. Nordlundb, T. Bierschenka, N. Kirbyc, C. Trautmannd, and P. Klutha a Department of Electronic Materials Engineering, Th Add to Reading List Source URL: hias.anu.edu.au Language: English - Date: 2012-03-16 00:48:00 Materials science Ion track Microtechnology Nanotechnology Swift heavy ion Electron beam Semiconductor device fabrication Rutherford backscattering spectrometry Ion implantation Chemistry Scientific method Science
498	Influence of Surface Photoluminescence of 1, 2 F. Voigt, Add to Reading List Source URL: www.quantsol.org Language: English - Date: 2011-03-17 17:06:36 Microtechnology Silicon Biomedical engineering Pharmacodynamics Porous silicon Solar cell Etching Passivation Doping Semiconductor device fabrication Materials science Technology
499	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M DEPARTMENT OF High Density Interconnect & Wafer Level Packaging Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-05-06 03:08:02 Technology Wafer-level packaging Microelectromechanical systems Wafer Three-dimensional integrated circuit Chip scale package Integrated circuit Flip chip Etching Semiconductor device fabrication Electronics Microtechnology
500	2687_Metri_8pg_Brochure.indd Add to Reading List Source URL: dl.dropboxusercontent.com Language: English Electronics manufacturing Optics Semiconductor device fabrication Manufacturing Wool measurement Integrated circuit Flexible circuit Resist Reticle Technology Electroforming Metal forming

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